cat. : TECHNICAL PUBLICATION
By T. NGUYEN, M. RHINDI, Y. HENRY, F. DESCHAMPS and G. PELLOQUIN. Lambda Mu 21 Congress "Risk management and digital transformation: opportunities and threats", October 2018, Reims, France.
FIDES methodology is becoming a reliable reference for dependability analysis. It offers a precise modelling of environment stress that the device has to encounter in real life application by creating a mission profile.
Depending on the life profile complexity, it is convenient to regroup similar phases, which makes the profile more pertinent.
This article discusses how to determine thermal cycling stress’ parameters (thermal cycle duration and thermal amplitude) for the phase after concatenation.
Two new methods are proposed to compute the thermal cycle duration. As for thermal amplitude, a new method based on Sedyakin’s principle is presented.
Recommendations for each method are also discussed. Numerical examples are presented to highlight theoretical results.
Find the publication here: https://hal.archives-ouvertes.fr/hal-02066406/document